• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    LAMP UNIT AND MANUFACTURING METHOD THEREOF A lamp unit (1) comprising: a light source module (2); and an optical system for projecting light emitted from the light source module (2) with a required light distribution. The light source module (2) comprises a thermally conductive plate (21), a plate fixed to the thermally conductive plate (21), and a light emitting element (23) mounted on the plate and powered by the intermediate of the plate. The thermally conductive plate (21) is provided with a mounting portion for mounting the optical system in a predetermined position with the light emitting element (23) as a reference. Figure for the abstract: Fig. 1.
    公开号:FR3081971A1
    申请号:FR1905852
    申请日:2019-06-03
    公开日:2019-12-06
    发明作者:Akitaka Kanamori
    申请人:Koito Manufacturing Co Ltd；
    IPC主号:
    专利说明:

    Description
    Title of the invention: LAMP UNIT AND MANUFACTURING METHOD THEREOF
    Technical Field [0001] The invention relates to a lamp unit suitable for use in a vehicle such as an automobile, and more particularly to a lamp unit using a light-emitting element such as a diode light emitting as a light source and a method of manufacturing the same.
    PRIOR ART A headlamp type lamp using a light-emitting diode (or LED for light-emitting diode) as a light source is intended as the light of an automobile, for example, a headlight. In this type of lamp, a light source and an optical system for irradiating light emitted from the light source with a required light distribution are included in the form of a unit. Document JP-A-2013-45601 (patent literature 1) describes a vehicle light comprising a lamp unit in which a light emitting diode module is configured by mounting a light emitting diode on a printed circuit board, or circuit board. power supply made of ceramic with high thermal conductivity and the light emitting diode module is fixed on a heat sink with an optical system.
    Such a light source unit requires an electrical connection configuration to an external power supply to cause the light emitting diode to emit light. In addition, such a light source unit must be arranged in a specific positional relation to an optical element such as a reflector or a projection lens for irradiating light by the light emitting diode towards the front of the lamp.
    In document JP-A-2013-45601, the light emitting diode module is positioned and fixed on the heat sink using a fixing element. In this way, a light emitting diode module is positioned and electrically connected to the external power supply by a wiring element provided in the fixing element.
    In document JP-A-2013-45601, the power supply plate which constitutes a light-emitting diode module is made of ceramic which is a thermally conductive insulating element. The reason is that an insulating element with high thermal conductivity is used so as to form a wiring element to power the light emitting diode on the power board and improve the heat dissipation effect of the heat generated when a diode light emitting light. In general, since the power plate made of ceramic is expensive, a light emitting diode module or the lamp unit comprising such a light emitting diode module is also expensive.
    In addition, in document JP-A-2013-45601, the fixing element for positioning and mounting the light emitting diode module on the heat sink is provided so as to improve the light distribution characteristic lamp unit. Therefore, the number of parts of the lamp unit is increased. In addition, since the fixing member forms the wiring member for powering the light emitting diode, the structure is complicated and expensive, and the lamp unit becomes more expensive.
    An object of the invention is to provide a lamp unit capable of reducing the number of parts and obtaining a low cost without deteriorating the heat dissipation effect and the light distribution characteristic, and a method the lamp unit.
    Disclosure of the invention This disclosure relates to a lamp unit comprising: a light source module; and an optical system for projecting light emitted from the light source module with a required light distribution. The light source module comprises a thermally conductive plate, a circuit board fixed to the thermally conductive plate, and a light emitting element mounted on the circuit board and supplied via the circuit board, and the thermally conductive plate is provided with a mounting portion for mounting the optical system in a predetermined position with the light emitting element as a reference.
    The thermally conductive plate can include a metal plate. The circuit board, or circuit board, can include a flexible printed circuit (or FPC for “flexible printed circuit board” in English) and can be supported on the thermally conductive plate, and the light-emitting element can be mounted on the flexible printed circuit. The optical system may include at least one of a reflector for reflecting light emitted by the light emitting element and a projection lens for projecting light emitted by the light emitting element light with a desired light distribution.
    The thermally conductive plate can include a part of a base supporting the optical system. A mounting hole into which a projection provided on the optical system is inserted can be opened as a mounting portion of the optical system in the thermally conductive plate. A heat dissipating fin can be formed on the thermally conductive plate and the mounting hole can be opened in a position avoiding the heat dissipating fin. The mounting hole can be opened at a thin-walled part in the thermally conductive plate.
    The present disclosure also relates to a method of manufacturing a lamp unit comprising: a step of mounting a circuit board provided with a light-emitting element on a thermally conductive plate; and a step of providing a mounting portion for mounting an optical system in a predetermined position of the thermally conductive plate with the light emitting element as a reference. The step of providing the mounting portion may include a step of drilling a hole by laser treatment.
    According to the present disclosure, the heat dissipation characteristics of the light emitting element can be improved by mounting the light emitting element on the thermally conductive plate. In addition, since the mounting part of the optical system provided on the thermally conductive plate is arranged in a predetermined position with the light emitting element mounted as a reference, it is possible to provide the lamp unit in which the characteristics light distribution are excellent in increasing the position accuracy of the relative position between the light emitting element and the optical system and in which the number of parts is reduced and the cost is obtained.
    Brief description of the drawings [fig.l] Figure 1 is a schematic sectional view of a headlight provided with a lamp unit of the invention;
    [Fig.2A-2B] Figure 2A is a partial sectional view of a lamp unit provided with a light source module in a first embodiment, and Figure 2B is a plan view schematic of the light source module;
    [Fig.3] Figure 3 is a partial exploded perspective view of the lamp unit according to the first embodiment;
    [Fig.4A-4B] Figure 4A is a partial sectional view of a lamp unit provided with a light source module in a reference embodiment, and Figure 4B is a view schematic plan of the light source module;
    [Fig.5A-5B] Figure 5A is a partial sectional view of a lamp unit provided with a light source module in a second embodiment, and Figure 5B is a plan view schematic of the light source module; and [fig.6] Figure 6 is a partial exploded perspective view of the lamp unit according to the second embodiment.
    Description of the embodiments (first embodiment)
    An embodiment of the invention will then be described with reference to the drawings. Figure 1 is a longitudinal sectional view of a first embodiment in which a lamp unit 1 of the invention is applied to an HL headlight of an automobile. The lamp unit 1 is installed inside a light housing 3 of the HL headlight and a light source module 2 is incorporated in the lamp unit L The lamp housing 3 comprises a lamp body in receptacle form 31 and a translucent front cover 32 fixed to a front opening of the lamp body 31.
    The lamp unit 1 has a base 11 made of metal such as aluminum, and the light source module 2 is mounted on the base 11. The base 11 is configured as a heat sink. A plurality of wall dissipating fins 111 are formed on a bottom surface of the base 11 to protrude downward in an aligned state. The light source module 2 is mounted in close contact with an upper surface of the base. Heat generated when the light source module 2 emits light is dissipated from the heat dissipating fins 111.
    In addition, a reflector 12 and a projection lens 13 are supported on the base 11. The reflector 12 has a generally spheroidal reflecting surface and is fixed on the base 11 so as to cover the light source module 2. In addition, the projection lens 13 is supported by a lens holder 131 at its peripheral edge portion. The lens holder 131 is supported by a rod 112 extending forward from the base 11. In this way, the reflector 12 and the projection lens 13 are supported relative to the base 11 in a predetermined position relationship .
    The lamp unit 1 is configured as a projector type lamp which provides lighting by reflecting light emitted by the light source module 2 through the reflector 12 and by projecting the light reflected on a front area d '' an automobile with a desired light distribution thanks to the projection lens 13.
    Figures 2A and 2B are a sectional view of a main part of the lamp unit 1 provided with the light source module 2 and a plan view of the light source module 2, and Figure 3 is an exploded perspective view of it. The light source module 2 comprises a rectangular thermally conductive plate having a required dimension, in this embodiment, a metal plate 21 made of aluminum. A flexible printed circuit 22 is bonded to the surface (upper surface) of the metal plate 21. In addition, a light emitting element in the form of a wafer, in this embodiment, a light emitting diode wafer (simply called here -after light-emitting diode) 23 is mounted on the surface of the flexible printed circuit 22.
    The light source module 2 will be described as well as its manufacturing process. In flexible circuit board 22, a circuit layout is configured by bonding a conductive wiring member such as a copper film to a flexible insulation film such as polyimide. The flexible printed circuit 22 is formed in the form of an elongated strip. A pad 221 for electrically connecting a light emitting diode 23 is formed as part of the circuit trace on the surface (upper surface) on an end side of the flexible printed circuit 22 in a longitudinal direction. The light-emitting diode 23 is mounted in a state electrically connected to the circuit layout of the flexible printed circuit 22 by an inverted wafer, that is to say by welding an electrode 231 provided in the light-emitting diode 23 on the stud with its surface light emission directed upwards. The flexible printed circuit 22 is supported on the metal plate 21 by being bonded to the surface of the metal plate 21 at the rear surface (bottom surface) of the area on the end side with an adhesive.
    The area on the other end side of the flexible printed circuit 22 extends from the metal plate 21 and a connector part 222 is formed at the other end part. Here, the connector portion 222 is configured as an edge connector using a circuit layout. In addition, as shown in Figure 1, the connector portion 222 is mounted on a power connector 41 electrically connected to a lighting circuit device 4 installed inside the lamp housing 3 and is electrically connected to the lighting circuit device 4.
    First circular mounting holes 21a are opened to penetrate in a plate thickness direction in two locations of the metal plate 21 enclosing the supported flexible printed circuit 22 in a width direction. Even when the flexible printed circuit 22 on which the light emitting diode 23 is mounted is supported on the metal plate 21, the holes can easily be opened in the metal plate 21 using machining or laser treatment. Consequently, the first two mounting holes 21a can be opened in positions having a specific position relation with the light-emitting diode 23 as a reference (that is to say a specific position relation with respect to the light-emitting diode 23). That is, a light emitting center of the light emitting diode 23, in other words, a central position P of a light emitting surface from which the emitted light is emitted is established as a reference position. The first mounting holes 21a are open in positions where the relative position between the reference position P and the central opening positions of the first mounting holes 21a have predetermined dimensional relationships respectively in a longitudinal direction and a width direction of the flexible printed circuit 22.
    On the other hand, two second mounting holes 1a are open in predetermined positions of the base 11 established in advance so as to correspond to the first mounting holes 21a of the metal plate 21. That is that is, the second mounting holes 11a are open in positions having a predetermined position relationship with respect to the projection lens 13 supported on the base 11. In the first embodiment, the base 11 is formed by flowing from the aluminum and the second mounting holes 11a are open when the base 11 is molded. The second mounting holes 11a can, however, be opened once the base 11 is formed. In addition, the second mounting holes 11a are provided in locations where the heat dissipation fins 111 do not exist.
    As shown in Figures 2A, 2B and 3, the light source module 2 configured in this way is mounted on the surface of the base 11. By mounting the light source module 2, the first two mounting holes 21a of the metal plate 21 are positioned so as to coincide with the second mounting holes 11a of the base 11, respectively. Next, the reflector 12 is fixed so as to cover the surface of the metal plate 21. The reflector 12 has two column-shaped projections 121 formed to protrude downward at two locations on its lower edge. These projections 121 are inserted through the first mounting holes 21a and then inserted into the second mounting holes 11a.
    With this insertion, the projections 121 are mounted in the first mounting holes 21a and the second mounting holes 11a, respectively. In this way, the reflector 12 is positioned relative to the metal plate 21 and the base 11. In addition, the reflector 12 is fixedly supported on the base 11 by screwing screws 123 into screw holes 11b open in the base 11 using fixing pieces 122 provided on the reflector 12.
    Furthermore, a grease or a sheet of grease having a high thermal conductivity can be interposed on the contact surface between the metal plate 21 and the base 11 to improve the thermal conductivity at the interface between the metal plate 21 and the base 11, thereby improving the heat dissipation effect of the light-emitting diode 23.
    In the lamp unit 1 provided with the light source module 2, a light emitting diode 23 is supplied with energy from the lighting circuit device 4 via the flexible printed circuit 22 and emits light. As shown schematically in Figure 1, the light emitted is reflected by the reflector 12 and is incident on the projection lens 13. The projection lens 13 then causes the emitted light to be irradiated on the front area of an automobile with required light distribution. The reflector 12 is positioned in a predetermined position relation with respect to the base 11 and the metal plate 21 by the first mounting holes 21a and the second mounting holes 11a. Consequently, the reflector 12 is supported in a predetermined position relation with respect to the flexible printed circuit 22 mounted on the metal plate 21 and also to the light-emitting diode 23 mounted on the flexible printed circuit 22.
    In this way, a first focal point F1 of the reflector 12 can be positioned with great precision relative to the light emitting center P of the light emitting diode 23. The light reflected by the reflector 12 is collected in a second focal point L2 of the reflector 12. In addition, since the projection lens 13 is positioned relative to the base 11, the projection lens 13 is also positioned in a predetermined position relationship with respect to the reflector 12 via the base 11 and the metal plate 21, and a focal point LO of the projection lens 13 can be positioned in a predetermined position relationship with respect to the second focal point L2 of the reflector 12. In this way, a predetermined light distribution by the projection lens 13 can be obtained.
    In the first embodiment, the light-emitting diode 23 is mounted on the flexible printed circuit 22 and electrically connected to the lighting circuit device 4 via the flexible printed circuit 22. Consequently, unlike the document JP-A-2013-45601, the supply circuit board made of an insulating material can be replaced by the metal plate 21 and a reduction in costs can be achieved. In addition, the heat generated when a light emitting diode 23 emits light is transferred to the base 11 serving as a heat sink via the metal plate 21 and dissipated by it, so that the dissipation effect of heat can be improved.
    Furthermore, when the light source module described in document JPA-2013-45601 is applied to the lamp unit of the first embodiment, as shown in the sectional view of FIG. 4A and the plan view of FIG. 4B, the light-emitting diode 23 is mounted on a circuit board, or supply board 21A and the flexible printed circuit 22 is connected to the supply circuit board 21A. And then, the power circuit board 21A is supported on the base 11 and electrically connected to a lighting circuit device. Therefore, the power circuit board 21A must form a circuit trace on a thermally conductive insulating plate, which leads to an increase in cost.
    In addition, in the first embodiment, the flexible printed circuit 22 on which a light emitting diode 23 is mounted is fixed on the metal plate 21, and then the first two mounting holes 21a are open in predetermined positions of the metal plate 21 with the light-emitting center P of the light-emitting diode 23 as a reference (i.e. predetermined positions of the metal plate 21 relative to the light-emitting center P of the diode 23). Consequently, even when the precision (error) of the mounting position of the light-emitting diode 23, i.e. the precision when fixing the flexible printed circuit 22 to the metal plate 21 is approximately ± 0 , 2mm, regardless of this, the position accuracy of the first mounting holes 21a relative to the light emitting center P of the light emitting diode 23 can be brought to ± 0.12mm or less of the maximum precision in the process of drilling.
    In the configuration using the power circuit board 21A shown in Figures 4A and 4B, it is difficult to open the holes once the power circuit board 21A is formed, and it is thus necessary to open the first mounting holes 21a by forming the supply circuit board 21 A. Therefore, even when the first mounting holes 21a are open in predetermined positions of the supply circuit board 21 A, the accuracy of approximately ± 0.2mm when a light emitting diode 23 is mounted on the power circuit board 21A is generated as a position error between the light emitting diode 23 and the first mounting hole 21a as it is.
    Laser machining or treatment is used in the process of drilling the first mounting holes 21a in the metal plate 21. However, the position accuracy of the first mounting holes 21a by the laser treatment is ± 0 0.05mm or less, which is 1/2 or less than by machining. Therefore, laser treatment is advantageous.
    As described above, in the first embodiment, the light source module 2 comprises the metal plate 21 and the flexible printed circuit 22 on which the light emitting diode 23 is mounted. Therefore, the fastener described in JP-A-2013-45601 is not necessary, and the number of parts can be reduced and cost reduction can be achieved. In addition, since the light-emitting diode 23 is mounted on the flexible printed circuit 22, the power circuit board made of ceramic or equivalent to form a power circuit is not necessary and cost reduction can be achieved. In addition, since the metal plate 21 is used, the heat dissipation effect of the light emitting diode can be improved.
    On the other hand, the first mounting holes 21a are open in the metal plate 21 with the light-emitting diode 23 mounted on the metal plate 21 as a reference using the metal plate 21 which is easily post-treated, so that the position accuracy between the light-emitting diode 23 and the reflector 12 can be improved. In addition, the positional accuracy between the light emitting diode 23 and the projection lens 13 can be improved by the first mounting holes 21a and the second mounting holes 11a, so that the light distribution characteristics of the lamp unit 1 can be controlled with great precision.
    (Second embodiment)
    Figures 5A and 5B are a partial sectional view of a lamp unit IA according to a second embodiment and a plan view of a light source module 2A, and Figure 6 is an exploded perspective view of them. Furthermore, the parts equivalent to those in the first embodiment are designated by the same references. The light source module 2A in the second embodiment includes a thermally conductive plate 21, the flexible printed circuit 22, and the light emitting diode 23. However, the thermally conductive plate 21 is configured as part of a metal base 11 of the IA lamp unit. Therefore, in the following, the thermally conductive plate 21 is referred to as the metal plate 21 (11) and will be described with its manufacturing process.
    The flexible printed circuit 22 is formed in the form of an elongated strip. The stud 221 for mounting the light-emitting diode 23 is formed at the level of the zone on one end side of the flexible printed circuit 22 in the longitudinal direction, and the light-emitting diode 23 is mounted on the flexible printed circuit 22 by means of a upturned wafer with its light emitting surface facing upwards. The flexible printed circuit 22 is bonded to the surface of the metal plate 21 (11) above the area of the required length from the area on the end side with an adhesive. In addition, the area on the other end side of the flexible printed circuit 22 protrudes from the metal plate 21 (11) and is electrically connected to the lighting circuit device 4 (see FIG. 1) thanks to the part of connector 222 provided at its end portion.
    The flexible printed circuit 22 is bonded to the surface (upper surface) of the metal plate 21 (11) formed as a part of the base 11. On a rear surface (lower surface) of the metal plate 21 (11) , a plurality of fins in the form of wall 211 projecting downward is formed in a row shape and also serves as a heat sink, as in the first embodiment.
    First circular mounting holes 21a are opened to penetrate in the direction of plate thickness in two locations of the metal plate 21 (11) enclosing the flexible printed circuit 22 in the width direction. As in the first embodiment, the open positions of the first two mounting holes are established in positions where the light emitting center P of the light emitting diode 23 is established as a reference position and the open positions have a relationship predetermined dimensional with respect to the reference position respectively in the longitudinal direction and the width direction of the flexible printed circuit 22.
    In addition, the reflector 12 is fixed to the surface of the metal plate 21 (11) so as to cover a light source unit 2A. The reflector 12 has two columnar projections 121 formed to protrude downward at two locations on its bottom edge. These projections 121 are inserted into the first mounting holes 21a. In addition, the reflector 12 is fixedly supported on the metal plate 21 (11) by screwing the screws 123 into open screw holes 21b in the metal plate 21 (11) using the fixing pieces 122 provided on the reflector 12.
    Referring to Figure 1, in the lamp unit IA provided with the light source module 2A, the light emitting diode 23 is supplied with energy via the flexible printed circuit 22 and emits the light. The emitted light is reflected by the reflector 12 and is incident on the projection lens 13. Then, the projection lens 13 causes the emitted light to be irradiated on the front area of an automobile with a desired light distribution. In addition, the relative position relationship between the first mounting holes 21a formed in the metal plate 21 (11) formed as a part of the base 11 and the light emitting diode 23 mounted thereon brings the reflector 12 and the projection lens 13 to be in a predetermined relative position with respect to the light-emitting diode 23 and a predetermined light distribution is obtained thanks to the light emitted by the light-emitting diode 23.
    In the second embodiment also, a light emitting diode 23 is supplied with energy via the flexible printed circuit 22, and thus, the supply circuit board 21A as shown in the figures 4A and 4B can be configured by the metal plate 21 (11). In this way, cost reduction can be achieved. In addition, the heat generated when a light emitting diode 23 emits light is dissipated by the metal plate 21 (11) serving as a heat sink, i.e. by the base 11, so that the effect heat dissipation can be improved.
    In addition, in the second embodiment, the metal plate 21 (11) is formed as a part of the base 11. Therefore, the second mounting holes 1a in the first embodiment do not exist and it is only necessary to open the first mounting holes 21a in the metal plate 21 (11). Since part of the base 11 constituting the metal plate 21 (11) is made of metal such as aluminum, the first two mounting holes 21a can be easily opened in predetermined positions with the light emitting center P of the light emitting diode 23 as a reference once the light emitting diode 23 and the flexible printed circuit 22 are supported on the metal plate 21 (11).
    Therefore, as in the first embodiment, even when the precision when fixing the flexible printed circuit 22 on the metal plate 21 (11) is about ± 0.2mm, regardless of this, the precision of position of the first mounting holes 21a relative to the light emission center P of the light emitting diode 23 can be brought to ± 0.12mm or less of the maximum precision in the drilling process. In this way, a decrease in the position accuracy between the reflector 12 and the light emitting center P of the light-emitting diode 23 can be avoided and the light distribution characteristics by the reflector 12 and the projection lens 13 can be avoided. be improved.
    In the second embodiment, the plurality of heat dissipation fins 211 is formed in the form of a row on the metal plate 21 (11), and the first mounting holes 21a are open in locations where the heat dissipation fins 211 do not exist. In addition, the metal plate 21 (11) is formed as part of the base 11 serving as a heat sink, and its plate thickness is set to be thicker than the metal plate of the first embodiment. Therefore, as shown in a partial enlarged view of Figure 5A, the thin-walled portions 212 whose plate thickness is partially reduced in advance are formed in locations on the rear surface of the metal plate 21 (11) where the first mounting holes 21a are open, and the first mounting holes 21a are open in the thin-walled portions 212, so that the operation of opening the first mounting holes 21a can be easily performed .
    In the second embodiment, the light source module 2A comprises the metal plate 21 (11) formed as a part of the base 11, the flexible printed circuit 22 and a light emitting diode 23, and a separate metal plate is not necessary. Therefore, the number of parts of the light source module 2A and the lamp unit IA can be reduced, and cost reduction can be achieved. In addition, since the light emitting diode 23 is mounted on the flexible printed circuit 22, the power circuit board made of ceramic or equivalent to form a circuit trace is not necessary, and cost reduction can be achieved. Furthermore, since the metal plate 21 (11) includes the heat dissipation fins 211, the heat dissipation effect of the light emitting diode 23 can be improved.
    Since the first mounting holes 21a for fixing the reflector 12 are open in the metal plate 21 (11) with the light-emitting diode 23 mounted on the flexible printed circuit 22 as a reference, the position accuracy between the light-emitting diode 23 and the reflector 12 can be improved. In addition, since the projection lens 13 is positioned relative to the base 11, the positional accuracy of the projection lens 13 relative to the metal plate 21 (11) formed as a part of the base 11 can be improved. Therefore, the position accuracy of the reflector 12 and the projection lens 13 relative to the light emitting diode 23 can be improved, so that the light distribution characteristics of the lamp unit IA can be controlled with a great precision.
    In the first and second embodiments, the reflector 12 is supported relative to the metal plate 21 and the base 11 using the fixing pieces 122 provided on the reflector 12. However, the reflector 12 can be supported in forming a male groove or a female groove at the end of each projection 121, by inserting the projections 121 through the first mounting holes 21a and the second mounting holes 11a, and then screwing nuts or screws from the lower side of metal plate 21 (11) or base 11.
    In the first and second embodiments, the reflector 12 is supported using the mounting holes 21a, lia provided in the metal plate 21 and the base 11 of the light source modules 2, 2A. However, in a lamp unit which does not have a reflector, for example, in a lamp unit configured to directly project the light emitted by a light emitting diode through a projection lens, the projection lens can be supported using mounting holes 21a, 11a provided in metal plate 21 and base 11. That is, an optical system of a lamp unit can be supported using mounting holes provided in a metal plate and a base. In this way, the positioning accuracy of an optical system relative to a light emitting diode can be improved.
    In the first and second embodiments, the reflector 12 is fixed using the mounting holes 21a open in the metal plate 21. However, the mounting part of the optical system in the invention can be configured as a part concave, a convex part or other structures capable of supporting the optical system by being mounted on a convex part or a concave part provided in the optical system such as a reflector.
    In the invention, the thermally conductive plate may not be a metal plate. The thermally conductive plate can be a low cost plate which is formed from a material of excellent thermal conductivity and in which a circuit path by a wiring element is not formed. In addition, the circuit board in the invention may not be a flexible printed circuit and may be configured as a wiring board in which a required circuit trace is formed. Furthermore, the light emitting element in the invention is not limited to a light emitting diode, but can be a light emitting element which is supplied with energy via the card. circuit and emits light, in particular, a semiconductor light emitting element.
    In addition, in the manufacturing process according to the invention, the process of fixing the circuit board to the thermally conductive plate is not limited to bonding as in the embodiments. For example, the circuit board can be attached to the thermally conductive plate using a screw or the like. In addition, the process of providing the mounting portion in a predetermined position of the thermally conductive plate with the light emitting element as a reference is also not limited to the process as in the embodiments, for example, laser treatment to form the mounting holes. Structures other than mounting holes can be mechanically treated.
    权利要求:
    Claims (1)
    [1" id="c-fr-0001]
    claims [Claim 1] Lamp unit (1) characterized in that it comprises:a light source module (2; 2A); andan optical system for projecting light emitted from the light source module (2; 2A) with a required light distribution, wherein the light source module (2; 2A) has a thermally conductive plate (21) , a circuit board (21A) fixed on the thermally conductive plate (21), and a light-emitting element (23) mounted on the circuit board (21A) and supplied via the circuit board ( 21A), andwherein the thermally conductive plate (21) is provided with a mounting portion for mounting the optical system in a predetermined position with the light emitting element (23) as a reference. [Claim 2] Lamp unit (1) according to claim 1,wherein the thermally conductive plate (21) comprises a metal plate. [Claim 3] Lamp unit (1) according to claim 1 or 2,wherein the circuit board (21 A) comprises a flexible printed circuit (22) and is supported on the thermally conductive plate (21), and the light emitting element (23) is mounted on the flexible printed circuit ( 22). [Claim 4] Lamp unit (1) according to any one of Claims 1 to 3, in which the optical system comprises at least one of a reflector (12) intended to reflect the light emitted by the light emitting element ( 23) and a projection lens (13) for projecting light emitted from the light emitting element (23) with a required light distribution. [Claim 5] Lamp unit (1) according to claim 4,wherein the thermally conductive plate (21) includes a portion of a base (11) supporting the optical system. [Claim 6] Lamp unit (1) according to claim 4, in which a mounting hole (21a) into which a projection (121) provided on the optical system is inserted is opened as a mounting part of the optical system in the thermally conductive plate (21 ). [Claim 7] Lamp unit (1) according to claim 6,
    wherein a heat dissipating fin (111) is formed on the thermally conductive plate (21) and the mounting hole (21a) is opened in a position avoiding the heat dissipating fin (111). [Claim 8] The lamp unit (1) according to claim 7, wherein the mounting hole (21a) is open at a thin walled portion provided in the thermally conductive plate (21). [Claim 9] Method for manufacturing a lamp unit (1), the method being characterized in that it comprises:a step of mounting a circuit board (21 A) provided with a light-emitting element (23) on a thermally conductive plate (21); anda step of providing a mounting portion for mounting an optical system in a predetermined position of the thermally conductive plate (21) with the light emitting element (23) as a reference. [Claim 10] Method according to claim 9,wherein the step of providing the mounting portion includes a step of drilling a hole with laser treatment
    1/6
    类似技术:
    公开号 | 公开日 | 专利标题
    FR3081971A1|2019-12-06|LAMP UNIT AND MANUFACTURING METHOD THEREOF
    FR2902493A1|2007-12-21|LIGHT SOURCE MODULE.
    US7663229B2|2010-02-16|Lighting device
    US7985014B2|2011-07-26|Light source module
    FR2907193A1|2008-04-18|LIGHT EMITTING MODULE AND LIGHTING DEVICE FOR VEHICLE
    EP1860707A1|2007-11-28|Heat dissipation component and LED lighting and/or signalling device comprising said component
    EP3104074B1|2019-03-13|Positioning device of a led support on a support element and illumination or signalisation device comprising such a device
    FR2970545A1|2012-07-20|SCIALYTIC LAMP WITH LED ORIENTATION BY SHAPE CONJUGATION ASSEMBLY
    US9035346B2|2015-05-19|Light source module
    FR2914984A1|2008-10-17|EQUIPPED FLEXIBLE ELECTRONIC SUPPORT SUPPORTING AT LEAST ONE ELECTROLUMINESCENT DIODE AND ASSOCIATED MANUFACTURING METHOD.
    EP3290791A1|2018-03-07|Motor vehicle light module with cooling member
    US20060284161A1|2006-12-21|Light source module and vehicle lamp
    FR3033623A1|2016-09-16|SOURCE MODULE OF LIGHT
    JP6638074B2|2020-01-29|Illumination configuration with accurate positioning of optical elements
    EP2947380B1|2018-12-19|Light-emitting module with light-emitting diode and screen
    EP1398563B1|2006-02-22|Power supply and mounting module for light-emitting diode
    FR2923286A3|2009-05-08|Lighting device e.g. lamp for use in e.g. office, has LED extending above opening of circuit board, and head electrically connected to wires that extend in through hole of base of body that is unitary assembly formed of single block
    EP3299702B1|2021-04-07|Luminous optical module of a motor vehicle
    FR3009365A1|2015-02-06|VEHICLE LAMP
    JP2015179641A|2015-10-08|Vehicular lighting fixture
    JP2015065034A|2015-04-09|Vehicular lighting fixture using light source module
    JP2019102398A|2019-06-24|Vehicular lighting fixture
    JP5406540B2|2014-02-05|LIGHT SOURCE MODULE, VEHICLE LIGHT, AND METHOD FOR MANUFACTURING LIGHT SOURCE MODULE
    EP3383150A1|2018-10-03|Power supply device for at least one led and at least one electronic component, comprising a power supply control circuit provided with an insert
    JP2019169278A|2019-10-03|On-vehicle lighting fixture and method of manufacturing on-vehicle lighting fixture
    同族专利:
    公开号 | 公开日
    DE102019208094A1|2019-12-05|
    CN209960391U|2020-01-17|
    CN110566897A|2019-12-13|
    US10634329B2|2020-04-28|
    FR3081971B1|2021-10-08|
    US20190368707A1|2019-12-05|
    BR102019011465A2|2019-12-10|
    JP2019212485A|2019-12-12|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    JP4102240B2|2003-04-08|2008-06-18|株式会社小糸製作所|Vehicle headlamp|
    CN1753193A|2004-09-21|2006-03-29|盟立光能科技股份有限公司|Luminous diode module for vehicle|
    CN201093292Y|2007-08-16|2008-07-30|大亿交通工业制造股份有限公司|LED car light cooling device|
    CN201382351Y|2009-04-07|2010-01-13|吉林东光瑞宝车灯有限责任公司|Reflection-type automobile head lamp|
    JP5442317B2|2009-05-14|2014-03-12|株式会社小糸製作所|Vehicle lighting|
    JP5627863B2|2009-09-03|2014-11-19|スタンレー電気株式会社|Vehicle headlamp|
    US9563008B2|2010-09-17|2017-02-07|Lg Innotek Co., Ltd.|Lighting module and lighting apparatus including the same|
    JP5597500B2|2010-09-28|2014-10-01|株式会社小糸製作所|Light emitting module and vehicle lamp|
    JP5746930B2|2011-08-24|2015-07-08|株式会社小糸製作所|Vehicle lighting|
    KR20130058350A|2011-11-25|2013-06-04|삼성전자주식회사|Light emitting diode for automobile lamp|
    KR101931492B1|2012-08-30|2018-12-21|삼성전자주식회사|Light source assembly|
    FR3003336B1|2013-03-18|2017-08-11|Valeo Vision|SIGNALING AND / OR LIGHTING DEVICES FOR MOTOR VEHICLES|
    KR20150015901A|2013-08-02|2015-02-11|김 스티븐|Automobile led head lamp module using flexible substrate and heat sink structure thereof|
    KR20150084311A|2014-01-13|2015-07-22|삼성전자주식회사|Light emitting module|
    EP3306182B1|2015-05-28|2020-08-05|LG Innotek Co., Ltd.|Light-emitting device package and vehicular light comprising same|
    KR101989099B1|2017-06-14|2019-06-13|엘지전자 주식회사|Lamp for vehicle and vehicle|
    JP2019212485A|2018-06-05|2019-12-12|株式会社小糸製作所|Lamp unit and manufacturing method of the same|DE102017104841A1|2017-03-08|2018-09-13|HELLA GmbH & Co. KGaA|Lighting device for vehicles and assembly methods|
    JP2019033160A|2017-08-07|2019-02-28|株式会社小糸製作所|Circuit board and lighting fixture for vehicle|
    JP2019212485A|2018-06-05|2019-12-12|株式会社小糸製作所|Lamp unit and manufacturing method of the same|
    KR20210127236A|2019-03-29|2021-10-21|교세라 가부시키가이샤|Device substrate, light emitting device module and light emitting device|
    DE102020108894A1|2020-03-31|2021-09-30|HELLA GmbH & Co. KGaA|Light module, headlight, motor vehicle and method for producing the light module|
    法律状态:
    2020-04-27| PLFP| Fee payment|Year of fee payment: 2 |
    2021-01-15| PLSC| Search report ready|Effective date: 20210115 |
    2021-04-27| PLFP| Fee payment|Year of fee payment: 3 |
    优先权:
    申请号 | 申请日 | 专利标题
    JP2018107780A|JP2019212485A|2018-06-05|2018-06-05|Lamp unit and manufacturing method of the same|
    JP2018-107780|2018-06-05|
    [返回顶部]